Apple M5 will use TSMC’s advanced 3NM chip technology

Apple will use TSMC’s advanced 3nm chipset processing technology for its next year’s M5 series processors for Mac devices reveals Supply chain analyst Ming-Chi Kuo.

Here’s what Kuo revealed:

The M5 series chips will adopt TSMC’s advanced N3P node, which entered the prototype phase a few months ago. M5, M5 Pro/Max, and M5 Ultra mass production is expected in 1H25, 2H25, and 2026, respectively.

Apple Mac (Image Credit: Apple)

The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.

Apple’s PCC infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.