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Apple M5 will use TSMC’s advanced 3NM chip technology

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Apple will use TSMC’s advanced 3nm chipset processing technology for its next year’s M5 series processors for Mac devices reveals Supply chain analyst Ming-Chi Kuo.

Here’s what Kuo revealed:

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The M5 series chips will adopt TSMC’s advanced N3P node, which entered the prototype phase a few months ago. M5, M5 Pro/Max, and M5 Ultra mass production is expected in 1H25, 2H25, and 2026, respectively.

Apple Mac

Apple Mac (Image Credit: Apple)

The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.

Apple’s PCC infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.

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